Rigid PCB Technical Capacity
|
Item
|
Capability
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|
| Month Capability | 1000 types/month | |
| 8,000 sqm/month | ||
| Layers: | 1-24 layers | |
| Board Material | Standard FR4: Shengyi, ITEQ, KB, GDM High TG: S1000-2, IT180 | |
| Surface treatment | OSP, HASL, LF-HASL, ENIG(Chem. Gold), Immersion Tin, Immersion silver, Plating hard gold, Gold fingers,Flash gold, ENEPIG | |
| Tolerance | Board thickness tolerance | 1.0mm: +/-0.1mm |
| 1.0mm-2.0mm: +/-10% | ||
| >2.0mm: +/-8% | ||
| Hole diameter tolerance | PTH: +/-0.075mm | |
| NPTH:+/-0.05mm | ||
| Hole location tolerance: | +/-0.075mm | |
| Outline tolerance: | < 100mm: +/-0.1mm | |
| 100mm-300mm: +/-0.15mm | ||
| >300mm: +/-0.2mm | ||
| Min line width/space: | 0.075/0.075mm(3mil/3mil) | |
| Technical Specification | Min hole: | 0.15mm (mechanical drilling) |
| 0.1mm (laser drilling) | ||
| Min pad ring: | ≥0.153mm（6mil） | |
| Max copper thickness: | 0.5Oz-12oz(18um-420Oz) | |
| Max board size: | 1-2 layers: 600x1400mm | |
| Multilayers: 400x600mm | ||
| Board thickness: | 2-layers: 0.2-7.0mm | |
| Multi-layers: 0.4-7.0mm | ||
| Inner layers: 0.1mm | ||
| Board warpage: | ≤1° | |
| Min solder mask bridge: | 0.1mm | |
| Plugging Vias capability: | 0.2-0.8mm | |
| Au, Ni thickness control: | Chem gold: Au:1-10u” | |
| Gold fingers: Au:1-150u” | ||
| Flash gold: Au:1-10u” | ||
| Hard gold:Au:1-150u” | ||
| Ni thickness:50-1000u” | ||
| ENEPIG: Au:1-8u”,Pd:2-5u | ||
