The material difference between high-frequency PCB and high-speed PCB

Update time : 2024-09-03 10:21:16

The material difference between high-frequency PCB and high-speed PCB

High frequency board and high-speed board are two common types of circuit boards in the electronics industry, and they have certain differences in material selection, design, manufacturing processes, and other aspects.

1、 Material type

1.1 High frequency board material

High frequency boards typically use high-performance high-frequency materials such as PTFE (polytetrafluoroethylene), FEP (fluorinated ethylene propylene), PPO (polyphenylene ether), PI (polyimide), etc. These materials have excellent high-frequency performance, such as low dielectric constant, low loss factor, high heat resistance, etc.

1.2 High speed board materials

The high-speed board mainly uses FR-4 (epoxy resin glass fiber cloth) material, which has good electrical and mechanical properties and cost-effectiveness. In addition, high-speed boards can also use high-performance materials such as PTFE, FEP, etc. to meet higher requirements for signal transmission speed and stability.

2、 Material properties

2.1 High frequency board material properties
High frequency board materials have the following main performance characteristics:
(1) Low dielectric constant: The dielectric constant of high-frequency board materials is usually between 2.0-3.5, much lower than that of FR-4 materials (about 4.0-4.5), which helps to improve signal transmission speed and reduce signal loss.
(2) Low loss factor: The loss factor of high-frequency board materials is usually between 0.001-0.003, much lower than that of FR-4 materials (about 0.02-0.04), which helps to reduce energy loss during signal transmission.
(3) High heat resistance: The heat resistance of high-frequency board materials is usually above 200 ℃, much higher than that of FR-4 materials (about 130 ℃), which helps to improve the reliability and stability of circuit boards.

2.2 Performance of high-speed board materials
The high-speed board material has the following main performance characteristics:
(1) Good electrical performance: FR-4 material has a low dielectric constant and loss factor, which can meet the requirements of high-speed signal transmission.
(2) Excellent mechanical properties: FR-4 material has high tensile strength, bending strength, and impact resistance, which can ensure the stability of circuit boards in various usage environments.
(3) Good cost-effectiveness: FR-4 material has lower production costs, which helps to reduce the overall cost of high-speed boards.

3、 Material cost
3.1 High frequency board material cost

High frequency board materials usually have high production costs, mainly due to the following reasons:
(1) Raw material costs: High frequency board materials such as PTFE, FEP, etc. have higher raw material prices, leading to increased production costs.
(2) Production process cost: The production process of high-frequency board materials is relatively complex, requiring the use of special equipment and technology, which increases production costs.
(3) Processing difficulty: The processing difficulty of high-frequency board materials is relatively high, requiring special processing methods such as laser drilling, micro hole processing, etc., which increases processing costs.

3.2 High speed board material cost
The cost of high-speed board materials is relatively low, mainly due to the following reasons:
(1) Raw material cost: FR-4 material has a lower raw material price, which helps to reduce production costs.
(2) Production process cost: The production process of FR-4 material is relatively mature, with high production efficiency, which helps to reduce production costs.
(3) Processing difficulty: The processing difficulty of FR-4 material is relatively small, and conventional processing methods can be used to reduce processing costs.

Shenzhen Meidear
Professional production, high-frequency, high-speed, HDI, LED lighting board, (Flex, Rigid-Flex,) (Wangling, Taiyao, Nanya, Isola, Rogers, Pana-sonic,) Quotation email: mkt@me-pcb.com

4、 Material application
4.1 Application of high-frequency board materials
High frequency board materials are mainly used in the following fields:
(1) Communication equipment, such as base stations, antennas, RF amplifiers, etc., require high-speed and low loss signal transmission.
(2) Radar systems, such as radar transmitters and receivers, require high-speed and high stability signal processing.
(3) Satellite communication: such as satellite ground stations, satellite repeaters, etc., require high-speed and high reliability signal transmission.
(4) Aerospace: such as navigation systems, communication systems, etc., require high-speed and high stability signal processing.

4.2 Application of high-speed board materials
High speed board materials are mainly used in the following fields:
(1) Computer hardware, such as CPU, GPU, memory, etc., requires high-speed and high stability data transmission.
(2) Network devices such as routers and switches require high-speed and highly reliable data transmission.
(3) Consumer electronics, such as smartphones, tablets, etc., require high-speed and high stability data transmission.
(4) Industrial control, such as PLC, DCS, etc., requires high-speed and high stability signal processing.

5、 Material development trend
5.1 Development Trends of High Frequency Board Materials
With the development of technologies such as 5G and the Internet of Things, the demand for high-frequency board materials will continue to grow. The future development trends of high-frequency board materials mainly include:
(1) Low dielectric constant: Developing materials with lower dielectric constants to improve signal transmission speed and reduce signal loss.
(2) Low loss factor: Develop materials with lower loss factors to reduce energy loss during signal transmission.

Previous : How many types of surface treatment processes for PCB?

Next : High-performance Thick copper heavy Copper PCB 6Oz 10Oz 20Oz